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Metallic
corrosion is caused primarily by the reaction of corrosive or reactive
atmospheric gases. These reactive gases (ozone, hydrogen
sulfide, carbonyl sulfide, hydrogen chloride, sulfur dioxide) easily
combine with metal surfaces causing corrosion and oxidation. Bell Labs determined that up to 80% of their latent, or premature
field defects were being caused by, or related to corrosion.
Gases
containing sulfur and chlorine are the major gases causing corrosion. Preventing corrosion means keeping
these and other reactive gases from attacking or contacting the
metal surfaces. Keeping these gases away from the
metal surfaces will keep the surfaces clean and free of oxidation
and corrosion.
How
do you effectively keep the gases away? The answer is Intercept
Technology * utilizing a revolutionary approach of inserting
highly reactive Copper into the polymer matrix.
This backbone of Copper forms a reactive barrier to the
gases. Because of
this torturous path through the Copper it is impossible for these
gases to pass through Intercept to attack what is inside the shrink-wrapped
film. While
inside the container, the Intercept acts as a preferential
corrosion site reacting and cleansing trapped air, making a safe
micro-environment for your stored/shipped objects. Intercept also provides protection
from static electricity the silent killer of electronics.
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| Advantages:
v ESD
and CDM safe
* In the ideal ESD range
v Environmentally and Personnel friendly
* Uses no oils NOT
A VCI
* Completely recyclable
v Unaffected by temperature or humidity
extremes
* Outdoor storage/shipment
stabilized
v Non-Contaminating
and Non-Outgassing:
Safe for all plastics and optics
(unlike VCIs)
* Contains no amines
Intercept
has been used successfully for years protecting everything from
satellites and sensitive guidance systems, optical switches, major
works of art, sculptures, silver, rubber components, paper, and
even guitar strings. The copper in the material helps control the
formation and growth of molds and mildew when in intimate contact
with the surface. One hallmark of this new polymer class
is that it is so versatile.
Bell Labs developed the Intercept technology as a way to better
protect their own systems. They discovered that corrosion weakens
electrical components, making them more sensitive to ESD effects.
Also, corrosion adversely effects solderability
it is very difficult to solder through corrosion or oxidation.
Intercept keeps surfaces pristine, enhancing solderability
and extending useful operating life of the electronic system or
component.
The
technology now is available by FPM as Intercept Shrinkfilm.
Ideal for military and commercial aviation, boat, equipment,
and materiel shipment/storage, Intercept provides 3-way protection,
using only 1 product.
Additional Info: www.shrinkwrapping.com
FPM Inc. (The Shrink-wrapping Company)
Tel 800-222-4449 (E.S.T.);
Fax 800-222-4456
Tel or Fax/250-539-5130
(P.S.T.) or
email: randydutton@gi-wireless.net
Contact:
Randy Dutton
Intercept is registered by EMI Corp.
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